Hybrid Microelectronics Handbook [antikvár]

PrefaceThe first edition of this book, the Handbook of Thick Film Hybrid Microelectronics, was pubhshed in 1974 when the hybrid microelectronics industry was relatively young, and represented, at the time, the most comprehensive reference available. Today, 21 years later, the industry has changed dramatically, and the second edition, titled the Hybrid Microelectronics Handbook, is intended to fill the same role. Even the term "hybrid microcircuit" has expanded in scope. Previously limited to only thick and thin film hybrid microcircuits, the hybrid technology encompasses new metallization technologies, such as direct bond copper (DBC), and new substrate materials, such as aluminum nitride.Certain aspects of the technology that merited entire chapters in the first edition have matured to the point that they may be addressed as subtopics in more comprehensive chapters, allowing more space to cover new technologies and materials.This edition consists of all new material by authors who are recognized experts in their respective fields, and is intended to be a practical reference for those who are active in all aspects of the hybrid technology. For the convenience of the reader, the authors attempted to write each chapter as an independent, "stand-alone" document, with all the pertinent data included for that topic. The result was a small degree of redundancy, with some material appearing in two different chapters.Chapter 1 is an introduction to the hybrid microelectronics technology and its appplications, and provides a broad overview of the remainder of the book. Chapter 2 describes certain of the ceramic substrate materials and provides a valuable insight into laser machining and how this approach can be used to the designer's advantage. Chapters 3 through 5 consider methods of metallizing substrates. Chapter 3 is an in-depth treatise of how thick film materials are manufactured and processed, and deals extensively with applications beyond the traditional conductor, resistor, and dielectric materials. Chapter 4 considers the thin film technology, which was not covered in the first edition. Methods of depositing and etching a wide variety of materials are covered, including superconducting materials. Chapter 5, which describes pure copperxlli